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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/GanH15>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chong_Leong_Gan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Uda_Hashim>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2015.02.010>
foaf:homepage <https://doi.org/10.1016/j.microrel.2015.02.010>
dc:identifier DBLP journals/mr/GanH15 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2015.02.010 (xsd:string)
dcterms:issued 2015 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Fundamentals of Lead-Free Solder Interconnect Technology (from Microstructures to Reliability). Springer (2015). XIII pp. 253, ISBN: 978-1-4614-9265-8 (Print), 978-1-4614-9266-5 (Online). (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chong_Leong_Gan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Uda_Hashim>
swrc:number 5 (xsd:string)
swrc:pages 852 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/GanH15/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/GanH15>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr55.html#GanH15>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2015.02.010>
dc:title Fundamentals of Lead-Free Solder Interconnect Technology (from Microstructures to Reliability). Springer (2015). XIII pp. 253, ISBN: 978-1-4614-9265-8 (Print), 978-1-4614-9266-5 (Online). (xsd:string)
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rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 55 (xsd:string)