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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/GaoYCCLL18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bing_Gao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chao_Liu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Fan_Yang_0045>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Minyou_Chen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wei_Lai>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yigao_Chen>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2017.12.046>
foaf:homepage <https://doi.org/10.1016/j.microrel.2017.12.046>
dc:identifier DBLP journals/mr/GaoYCCLL18 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2017.12.046 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bing_Gao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chao_Liu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Fan_Yang_0045>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Minyou_Chen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wei_Lai>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yigao_Chen>
swrc:pages 51-61 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/GaoYCCLL18/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/GaoYCCLL18>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr82.html#GaoYCCLL18>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2017.12.046>
dc:title Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 82 (xsd:string)