Silicon based system in package: Improvement of passive integration process to avoid TBMS failure.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/mr/GautierLJNGD08
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Silicon based system in package: Improvement of passive integration process to avoid TBMS failure.
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Silicon based system in package: Improvement of passive integration process to avoid TBMS failure.
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