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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/GuojunRLB10>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hu_Guojun>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jing-en_Luan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Roberto_Rossi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xavier_Baraton>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2010.03.012>
foaf:homepage <https://doi.org/10.1016/j.microrel.2010.03.012>
dc:identifier DBLP journals/mr/GuojunRLB10 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2010.03.012 (xsd:string)
dcterms:issued 2010 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Interface delamination analysis of TQFP package during solder reflow. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hu_Guojun>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jing-en_Luan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Roberto_Rossi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xavier_Baraton>
swrc:number 7 (xsd:string)
swrc:pages 1014-1020 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/GuojunRLB10/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/GuojunRLB10>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr50.html#GuojunRLB10>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2010.03.012>
dc:title Interface delamination analysis of TQFP package during solder reflow. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 50 (xsd:string)