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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/HoLSRVB03>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Charles_J._Vath>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Eric_Beyne>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hong_Meng_Ho>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Petar_Ratchev>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Serguei_Stoukatch>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wai_Lam>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2FS0026-2714%2803%2900074-X>
foaf:homepage <https://doi.org/10.1016/S0026-2714(03)00074-X>
dc:identifier DBLP journals/mr/HoLSRVB03 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2FS0026-2714%2803%2900074-X (xsd:string)
dcterms:issued 2003 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Direct gold and copper wires bonding on copper. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Charles_J._Vath>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Eric_Beyne>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hong_Meng_Ho>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Petar_Ratchev>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Serguei_Stoukatch>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wai_Lam>
swrc:number 6 (xsd:string)
swrc:pages 913-923 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/HoLSRVB03/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/HoLSRVB03>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr43.html#HoLSRVB03>
rdfs:seeAlso <https://doi.org/10.1016/S0026-2714(03)00074-X>
dc:title Direct gold and copper wires bonding on copper. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 43 (xsd:string)