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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/HongLKKJ11>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jae_Pil_Jung>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jong_Hyeong_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sung_Chul_Hong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wang_Gu_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Won_Joong_Kim>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2011.06.031>
foaf:homepage <https://doi.org/10.1016/j.microrel.2011.06.031>
dc:identifier DBLP journals/mr/HongLKKJ11 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2011.06.031 (xsd:string)
dcterms:issued 2011 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jae_Pil_Jung>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jong_Hyeong_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sung_Chul_Hong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wang_Gu_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Won_Joong_Kim>
swrc:number 12 (xsd:string)
swrc:pages 2228-2235 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/HongLKKJ11/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/HongLKKJ11>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr51.html#HongLKKJ11>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2011.06.031>
dc:title Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 51 (xsd:string)