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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/HuangTZTWL16>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/De-Shau_Huang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Liang-Te_Tsai>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ming-Tzer_Lin>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ti-Yuan_Wu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wen-Bin_Tu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xiu-Ming_Zhang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2016.07.006>
foaf:homepage <https://doi.org/10.1016/j.microrel.2016.07.006>
dc:identifier DBLP journals/mr/HuangTZTWL16 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2016.07.006 (xsd:string)
dcterms:issued 2016 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/De-Shau_Huang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Liang-Te_Tsai>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ming-Tzer_Lin>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ti-Yuan_Wu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wen-Bin_Tu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xiu-Ming_Zhang>
swrc:pages 131-141 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/HuangTZTWL16/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/HuangTZTWL16>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr65.html#HuangTZTWL16>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2016.07.006>
dc:title Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 65 (xsd:string)