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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/ItoTSMSONA12>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Isamu_Taguchi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Masahiko_Mitsuhashi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Masayasu_Soga>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Nobuyuki_Akiyama>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takashi_Nishimori>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takeshi_Ito>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Toshinori_Ogashiwa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Toshiro_Shinohara>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2011.07.094>
foaf:homepage <https://doi.org/10.1016/j.microrel.2011.07.094>
dc:identifier DBLP journals/mr/ItoTSMSONA12 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2011.07.094 (xsd:string)
dcterms:issued 2012 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Thermal stability of back side metallization multilayer for power device application. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Isamu_Taguchi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Masahiko_Mitsuhashi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Masayasu_Soga>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Nobuyuki_Akiyama>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takashi_Nishimori>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takeshi_Ito>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Toshinori_Ogashiwa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Toshiro_Shinohara>
swrc:number 1 (xsd:string)
swrc:pages 199-205 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/ItoTSMSONA12/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/ItoTSMSONA12>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr52.html#ItoTSMSONA12>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2011.07.094>
dc:title Thermal stability of back side metallization multilayer for power device application. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 52 (xsd:string)