Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/mr/JinkaDGL09
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/mr/JinkaDGL09
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/A._Dasgupta
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/K._K._Jinka
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/S._Ganesan
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/S._Ling
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2009.02.008
>
foaf:
homepage
<
https://doi.org/10.1016/j.microrel.2009.02.008
>
dc:
identifier
DBLP journals/mr/JinkaDGL09
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1016%2Fj.microrel.2009.02.008
(xsd:string)
dcterms:
issued
2009
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/mr
>
rdfs:
label
Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/A._Dasgupta
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/K._K._Jinka
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/S._Ganesan
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/S._Ling
>
swrc:
number
5
(xsd:string)
swrc:
pages
523-529
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/mr/JinkaDGL09/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/mr/JinkaDGL09
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/mr/mr49.html#JinkaDGL09
>
rdfs:
seeAlso
<
https://doi.org/10.1016/j.microrel.2009.02.008
>
dc:
title
Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
49
(xsd:string)