Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages.
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/mr/LaiSLW12
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Chang-Chi_Lee
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Meng-Kai_Shih
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Tong_Hong_Wang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Yi-Shao_Lai
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2012.05.007
>
foaf:
homepage
<
https://doi.org/10.1016/j.microrel.2012.05.007
>
dc:
identifier
DBLP journals/mr/LaiSLW12
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1016%2Fj.microrel.2012.05.007
(xsd:string)
dcterms:
issued
2012
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/mr
>
rdfs:
label
Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Chang-Chi_Lee
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Meng-Kai_Shih
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Tong_Hong_Wang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Yi-Shao_Lai
>
swrc:
number
11
(xsd:string)
swrc:
pages
2851-2855
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/mr/LaiSLW12/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/mr/LaiSLW12
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/mr/mr52.html#LaiSLW12
>
rdfs:
seeAlso
<
https://doi.org/10.1016/j.microrel.2012.05.007
>
dc:
title
Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
52
(xsd:string)