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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/LaiW07>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tong_Hong_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yi-Shao_Lai>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2006.04.008>
foaf:homepage <https://doi.org/10.1016/j.microrel.2006.04.008>
dc:identifier DBLP journals/mr/LaiW07 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2006.04.008 (xsd:string)
dcterms:issued 2007 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tong_Hong_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yi-Shao_Lai>
swrc:number 1 (xsd:string)
swrc:pages 104-110 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/LaiW07/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/LaiW07>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr47.html#LaiW07>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2006.04.008>
dc:title Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 47 (xsd:string)