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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/LaorARCM17>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Alireza_Rezvani>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ari_Laor>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Depayne_Athia>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Horst_Clauberg>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Michael_Mayer>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2017.03.001>
foaf:homepage <https://doi.org/10.1016/j.microrel.2017.03.001>
dc:identifier DBLP journals/mr/LaorARCM17 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2017.03.001 (xsd:string)
dcterms:issued 2017 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Alireza_Rezvani>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ari_Laor>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Depayne_Athia>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Horst_Clauberg>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Michael_Mayer>
swrc:pages 60-68 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/LaorARCM17/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/LaorARCM17>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr73.html#LaorARCM17>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2017.03.001>
dc:title Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 73 (xsd:string)