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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/LauY12>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/John_H._Lau>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tang_Gong_Yue>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2012.04.002>
foaf:homepage <https://doi.org/10.1016/j.microrel.2012.04.002>
dc:identifier DBLP journals/mr/LauY12 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2012.04.002 (xsd:string)
dcterms:issued 2012 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP). (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/John_H._Lau>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tang_Gong_Yue>
swrc:number 11 (xsd:string)
swrc:pages 2660-2669 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/LauY12/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/LauY12>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr52.html#LauY12>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2012.04.002>
dc:title Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP). (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 52 (xsd:string)