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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/LeeBHW17>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hosung_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Nelson_Hua>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sanghyeon_Baeg>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shi-Jie_Wen>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2016.12.010>
foaf:homepage <https://doi.org/10.1016/j.microrel.2016.12.010>
dc:identifier DBLP journals/mr/LeeBHW17 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2016.12.010 (xsd:string)
dcterms:issued 2017 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hosung_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Nelson_Hua>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sanghyeon_Baeg>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shi-Jie_Wen>
swrc:pages 88-99 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/LeeBHW17/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/LeeBHW17>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr69.html#LeeBHW17>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2016.12.010>
dc:title Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 69 (xsd:string)