Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint.
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bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/mr/LeeKTSYKU11
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Katsuaki_Suganuma
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Keun-Soo_Kim
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Kiju_Lee
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Kimihiro_Yamanaka
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Minoru_Ueshima
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Soichi_Kuritani
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Yutaka_Tsukada
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2011.05.003
>
foaf:
homepage
<
https://doi.org/10.1016/j.microrel.2011.05.003
>
dc:
identifier
DBLP journals/mr/LeeKTSYKU11
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1016%2Fj.microrel.2011.05.003
(xsd:string)
dcterms:
issued
2011
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/mr
>
rdfs:
label
Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Katsuaki_Suganuma
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Keun-Soo_Kim
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Kiju_Lee
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Kimihiro_Yamanaka
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Minoru_Ueshima
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Soichi_Kuritani
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Yutaka_Tsukada
>
swrc:
number
12
(xsd:string)
swrc:
pages
2290-2297
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/mr/LeeKTSYKU11/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/mr/LeeKTSYKU11
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/mr/mr51.html#LeeKTSYKU11
>
rdfs:
seeAlso
<
https://doi.org/10.1016/j.microrel.2011.05.003
>
dc:
title
Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
51
(xsd:string)