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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/LiDJ18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Christopher_Mark_Johnson>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jianfeng_Li_0002>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jingru_Dai>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2018.03.013>
foaf:homepage <https://doi.org/10.1016/j.microrel.2018.03.013>
dc:identifier DBLP journals/mr/LiDJ18 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2018.03.013 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Christopher_Mark_Johnson>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jianfeng_Li_0002>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jingru_Dai>
swrc:pages 55-65 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/LiDJ18/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/LiDJ18>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr84.html#LiDJ18>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2018.03.013>
dc:title Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 84 (xsd:string)