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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/LibotADAMD18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/F._Dulondel>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/J._B._Libot>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jo%E2%88%9A%C4%99l_Alexis>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/L._Arnaud>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Olivier_Dalverny>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/P._Milesi>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2018.02.009>
foaf:homepage <https://doi.org/10.1016/j.microrel.2018.02.009>
dc:identifier DBLP journals/mr/LibotADAMD18 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2018.02.009 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/F._Dulondel>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/J._B._Libot>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jo%E2%88%9A%C4%99l_Alexis>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/L._Arnaud>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Olivier_Dalverny>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/P._Milesi>
swrc:pages 64-76 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/LibotADAMD18/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/LibotADAMD18>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr83.html#LibotADAMD18>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2018.02.009>
dc:title Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 83 (xsd:string)