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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/LimCYCGC14>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Adeline_B._Y._Lim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Andrew_C._K._Chang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bob_Chylak>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chee_Lip_Gan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Oranna_Yauw>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Zhong_Chen_0004>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2014.05.005>
foaf:homepage <https://doi.org/10.1016/j.microrel.2014.05.005>
dc:identifier DBLP journals/mr/LimCYCGC14 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2014.05.005 (xsd:string)
dcterms:issued 2014 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Adeline_B._Y._Lim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Andrew_C._K._Chang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bob_Chylak>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chee_Lip_Gan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Oranna_Yauw>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Zhong_Chen_0004>
swrc:number 11 (xsd:string)
swrc:pages 2555-2563 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/LimCYCGC14/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/LimCYCGC14>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr54.html#LimCYCGC14>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2014.05.005>
dc:title Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 54 (xsd:string)