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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/LinC11>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hsiu-Jen_Lin>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tung-Han_Chuang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2010.07.061>
foaf:homepage <https://doi.org/10.1016/j.microrel.2010.07.061>
dc:identifier DBLP journals/mr/LinC11 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2010.07.061 (xsd:string)
dcterms:issued 2011 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hsiu-Jen_Lin>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tung-Han_Chuang>
swrc:number 2 (xsd:string)
swrc:pages 445-452 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/LinC11/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/LinC11>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr51.html#LinC11>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2010.07.061>
dc:title Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 51 (xsd:string)