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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/LiuLZWYZSL14>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Cadmus_A._Yuan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Cell_K._Y._Wong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Fenglian_Sun>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Guoqi_Zhang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jia_Zhao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Liangliang_Luo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Stanley_Y._Y._Leung>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yang_Liu_0103>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2014.07.034>
foaf:homepage <https://doi.org/10.1016/j.microrel.2014.07.034>
dc:identifier DBLP journals/mr/LiuLZWYZSL14 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2014.07.034 (xsd:string)
dcterms:issued 2014 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Thermal and mechanical effects of voids within flip chip soldering in LED packages. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Cadmus_A._Yuan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Cell_K._Y._Wong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Fenglian_Sun>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Guoqi_Zhang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jia_Zhao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Liangliang_Luo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Stanley_Y._Y._Leung>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yang_Liu_0103>
swrc:number 9-10 (xsd:string)
swrc:pages 2028-2033 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/LiuLZWYZSL14/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/LiuLZWYZSL14>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr54.html#LiuLZWYZSL14>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2014.07.034>
dc:title Thermal and mechanical effects of voids within flip chip soldering in LED packages. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 54 (xsd:string)