[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/LiuXLD01>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/David_A._Dillard>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Guo-Quan_Lu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shuangyan_Xu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xingsheng_Liu>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2FS0026-2714%2801%2900117-2>
foaf:homepage <https://doi.org/10.1016/S0026-2714(01)00117-2>
dc:identifier DBLP journals/mr/LiuXLD01 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2FS0026-2714%2801%2900117-2 (xsd:string)
dcterms:issued 2001 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Stacked solder bumping technology for improved solder joint reliability. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/David_A._Dillard>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Guo-Quan_Lu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shuangyan_Xu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xingsheng_Liu>
swrc:number 12 (xsd:string)
swrc:pages 1979-1992 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/LiuXLD01/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/LiuXLD01>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr41.html#LiuXLD01>
rdfs:seeAlso <https://doi.org/10.1016/S0026-2714(01)00117-2>
dc:title Stacked solder bumping technology for improved solder joint reliability. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 41 (xsd:string)