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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/LukCH02>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/C._F._Luk>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/K._C._Hung>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Y._C._Chan>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2FS0026-2714%2801%2900256-6>
foaf:homepage <https://doi.org/10.1016/S0026-2714(01)00256-6>
dc:identifier DBLP journals/mr/LukCH02 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2FS0026-2714%2801%2900256-6 (xsd:string)
dcterms:issued 2002 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/C._F._Luk>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/K._C._Hung>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Y._C._Chan>
swrc:number 3 (xsd:string)
swrc:pages 381-389 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/LukCH02/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/LukCH02>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr42.html#LukCH02>
rdfs:seeAlso <https://doi.org/10.1016/S0026-2714(01)00256-6>
dc:title Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 42 (xsd:string)