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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/MaKK14>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Junsung_Ma>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sarah_Eunkyung_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sungdong_Kim>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2014.03.022>
foaf:homepage <https://doi.org/10.1016/j.microrel.2014.03.022>
dc:identifier DBLP journals/mr/MaKK14 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2014.03.022 (xsd:string)
dcterms:issued 2014 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Characterization of flip chip bonded structure with Cu ABL power bumps. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Junsung_Ma>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sarah_Eunkyung_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sungdong_Kim>
swrc:number 8 (xsd:string)
swrc:pages 1598-1602 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/MaKK14/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/MaKK14>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr54.html#MaKK14>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2014.03.022>
dc:title Characterization of flip chip bonded structure with Cu ABL power bumps. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 54 (xsd:string)