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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/MagnienMRSHGHDK17>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Elke_Kraker>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Franz_Schrank>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/J%E2%88%9A%E2%88%82rdis_Rosc>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Julien_Magnien>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lena_Goullon>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lisa_Mitterhuber>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Matthias_Hutter>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Stefan_Defregger>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Stefan_H%E2%88%9A%E2%88%82rth>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2017.07.052>
foaf:homepage <https://doi.org/10.1016/j.microrel.2017.07.052>
dc:identifier DBLP journals/mr/MagnienMRSHGHDK17 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2017.07.052 (xsd:string)
dcterms:issued 2017 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Elke_Kraker>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Franz_Schrank>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/J%E2%88%9A%E2%88%82rdis_Rosc>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Julien_Magnien>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lena_Goullon>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lisa_Mitterhuber>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Matthias_Hutter>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Stefan_Defregger>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Stefan_H%E2%88%9A%E2%88%82rth>
swrc:pages 601-605 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/MagnienMRSHGHDK17/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/MagnienMRSHGHDK17>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr76.html#MagnienMRSHGHDK17>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2017.07.052>
dc:title Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 76-77 (xsd:string)