Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation.
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/mr/MagnienMRSHGHDK17
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Elke_Kraker
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Franz_Schrank
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/J%E2%88%9A%E2%88%82rdis_Rosc
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Julien_Magnien
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Lena_Goullon
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Lisa_Mitterhuber
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Matthias_Hutter
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Stefan_Defregger
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Stefan_H%E2%88%9A%E2%88%82rth
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2017.07.052
>
foaf:
homepage
<
https://doi.org/10.1016/j.microrel.2017.07.052
>
dc:
identifier
DBLP journals/mr/MagnienMRSHGHDK17
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1016%2Fj.microrel.2017.07.052
(xsd:string)
dcterms:
issued
2017
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/mr
>
rdfs:
label
Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Elke_Kraker
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Franz_Schrank
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/J%E2%88%9A%E2%88%82rdis_Rosc
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Julien_Magnien
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Lena_Goullon
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Lisa_Mitterhuber
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Matthias_Hutter
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Stefan_Defregger
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Stefan_H%E2%88%9A%E2%88%82rth
>
swrc:
pages
601-605
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/mr/MagnienMRSHGHDK17/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/mr/MagnienMRSHGHDK17
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/mr/mr76.html#MagnienMRSHGHDK17
>
rdfs:
seeAlso
<
https://doi.org/10.1016/j.microrel.2017.07.052
>
dc:
title
Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
76-77
(xsd:string)