[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/MaoC08>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chao-Yang_Mao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rong-Sheng_Chen>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2007.01.087>
foaf:homepage <https://doi.org/10.1016/j.microrel.2007.01.087>
dc:identifier DBLP journals/mr/MaoC08 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2007.01.087 (xsd:string)
dcterms:issued 2008 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chao-Yang_Mao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rong-Sheng_Chen>
swrc:number 1 (xsd:string)
swrc:pages 119-131 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/MaoC08/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/MaoC08>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr48.html#MaoC08>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2007.01.087>
dc:title Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 48 (xsd:string)