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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/MelamedWNSKA16>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Haruo_Shimamoto>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Katsuya_Kikuchi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Masahiro_Aoyagi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Naoya_Watanabe>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Samson_Melamed>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shunsuke_Nemoto>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2016.08.015>
foaf:homepage <https://doi.org/10.1016/j.microrel.2016.08.015>
dc:identifier DBLP journals/mr/MelamedWNSKA16 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2016.08.015 (xsd:string)
dcterms:issued 2016 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Haruo_Shimamoto>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Katsuya_Kikuchi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Masahiro_Aoyagi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Naoya_Watanabe>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Samson_Melamed>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shunsuke_Nemoto>
swrc:pages 2-8 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/MelamedWNSKA16/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/MelamedWNSKA16>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr67.html#MelamedWNSKA16>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2016.08.015>
dc:title Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 67 (xsd:string)