[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/MutchPBCLLNBFKF16>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Benjamin_French>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Brad_C._Bittel>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Corey_J._Cochrane>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Justin_Brockman>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Marc_French>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Markus_Kuhn>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Michael_J._Mutch>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Patrick_M._Lenahan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Robert_J._Nemanich>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sean_W._King>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Thomas_Pomorski>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xin_Liu>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2016.04.004>
foaf:homepage <https://doi.org/10.1016/j.microrel.2016.04.004>
dc:identifier DBLP journals/mr/MutchPBCLLNBFKF16 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2016.04.004 (xsd:string)
dcterms:issued 2016 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Band diagram for low-k/Cu interconnects: The starting point for understanding back-end-of-line (BEOL) electrical reliability. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Benjamin_French>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Brad_C._Bittel>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Corey_J._Cochrane>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Justin_Brockman>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Marc_French>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Markus_Kuhn>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Michael_J._Mutch>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Patrick_M._Lenahan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Robert_J._Nemanich>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sean_W._King>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Thomas_Pomorski>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xin_Liu>
swrc:pages 201-213 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/MutchPBCLLNBFKF16/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/MutchPBCLLNBFKF16>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr63.html#MutchPBCLLNBFKF16>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2016.04.004>
dc:title Band diagram for low-k/Cu interconnects: The starting point for understanding back-end-of-line (BEOL) electrical reliability. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 63 (xsd:string)