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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/NgAA18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Aizat_Abas>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Fei_Chong_Ng>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mohd_Zulkifly_Abdullah>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2017.12.025>
foaf:homepage <https://doi.org/10.1016/j.microrel.2017.12.025>
dc:identifier DBLP journals/mr/NgAA18 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2017.12.025 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Aizat_Abas>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Fei_Chong_Ng>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mohd_Zulkifly_Abdullah>
swrc:pages 41-63 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/NgAA18/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/NgAA18>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr81.html#NgAA18>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2017.12.025>
dc:title Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 81 (xsd:string)