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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/OgdenXYSLP18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Joel_L._Plawsky>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kong_Boon_Yeap>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sean_P._Ogden>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tian_Shen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Toh-Ming_Lu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yueming_Xu>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2018.10.005>
foaf:homepage <https://doi.org/10.1016/j.microrel.2018.10.005>
dc:identifier DBLP journals/mr/OgdenXYSLP18 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2018.10.005 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Charge transport model to predict dielectric breakdown as a function of voltage, temperature, and thickness. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Joel_L._Plawsky>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kong_Boon_Yeap>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sean_P._Ogden>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tian_Shen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Toh-Ming_Lu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yueming_Xu>
swrc:pages 232-242 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/OgdenXYSLP18/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/OgdenXYSLP18>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr91.html#OgdenXYSLP18>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2018.10.005>
dc:title Charge transport model to predict dielectric breakdown as a function of voltage, temperature, and thickness. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 91 (xsd:string)