TSV by 355 UV laser for 4G component packaging with micro-electroforming.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/mr/PanCWCYLS17
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/mr/PanCWCYLS17
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Cheng-Tang_Pan
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Chung-Kun_Yen
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Shao-Yu_Wang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/W._C._Shih
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Y._C._Chen
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Y._L._Lin
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Y._T._Cheng
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2017.09.023
>
foaf:
homepage
<
https://doi.org/10.1016/j.microrel.2017.09.023
>
dc:
identifier
DBLP journals/mr/PanCWCYLS17
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1016%2Fj.microrel.2017.09.023
(xsd:string)
dcterms:
issued
2017
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/mr
>
rdfs:
label
TSV by 355 UV laser for 4G component packaging with micro-electroforming.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Cheng-Tang_Pan
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Chung-Kun_Yen
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Shao-Yu_Wang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/W._C._Shih
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Y._C._Chen
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Y._L._Lin
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Y._T._Cheng
>
swrc:
pages
331-338
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/mr/PanCWCYLS17/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/mr/PanCWCYLS17
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/mr/mr78.html#PanCWCYLS17
>
rdfs:
seeAlso
<
https://doi.org/10.1016/j.microrel.2017.09.023
>
dc:
title
TSV by 355 UV laser for 4G component packaging with micro-electroforming.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
78
(xsd:string)