An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/mr/PoshtanRSW16
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/mr/PoshtanRSW16
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Bernhard_Wunderle
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Christian_Silber
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Emad_A._Poshtan
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Sven_Rzepka
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2016.03.017
>
foaf:
homepage
<
https://doi.org/10.1016/j.microrel.2016.03.017
>
dc:
identifier
DBLP journals/mr/PoshtanRSW16
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1016%2Fj.microrel.2016.03.017
(xsd:string)
dcterms:
issued
2016
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/mr
>
rdfs:
label
An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Bernhard_Wunderle
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Christian_Silber
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Emad_A._Poshtan
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Sven_Rzepka
>
swrc:
pages
18-25
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/mr/PoshtanRSW16/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/mr/PoshtanRSW16
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/mr/mr62.html#PoshtanRSW16
>
rdfs:
seeAlso
<
https://doi.org/10.1016/j.microrel.2016.03.017
>
dc:
title
An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
62
(xsd:string)