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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/ShaoWBZZL18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Aiping_Wu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Guisheng_Zou>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Huakai_Shao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lei_Liu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yudian_Bao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yue_Zhao>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2018.08.004>
foaf:homepage <https://doi.org/10.1016/j.microrel.2018.08.004>
dc:identifier DBLP journals/mr/ShaoWBZZL18 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2018.08.004 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Thermal reliability investigation of Ag-Sn TLP bonds for high-temperature power electronics application. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Aiping_Wu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Guisheng_Zou>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Huakai_Shao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lei_Liu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yudian_Bao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yue_Zhao>
swrc:pages 38-45 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/ShaoWBZZL18/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/ShaoWBZZL18>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr91.html#ShaoWBZZL18>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2018.08.004>
dc:title Thermal reliability investigation of Ag-Sn TLP bonds for high-temperature power electronics application. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 91 (xsd:string)