[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/SiauBCHT05>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Andr%E2%88%9A%C2%A9_Van_Calster>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Johan_de_Baets>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Leon_Heremans>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sam_Siau>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sammy_Tanghe>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2004.07.009>
foaf:homepage <https://doi.org/10.1016/j.microrel.2004.07.009>
dc:identifier DBLP journals/mr/SiauBCHT05 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2004.07.009 (xsd:string)
dcterms:issued 2005 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Andr%E2%88%9A%C2%A9_Van_Calster>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Johan_de_Baets>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Leon_Heremans>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sam_Siau>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sammy_Tanghe>
swrc:number 3-4 (xsd:string)
swrc:pages 675-687 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/SiauBCHT05/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/SiauBCHT05>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr45.html#SiauBCHT05>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2004.07.009>
dc:title Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 45 (xsd:string)