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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/StrandjordPJ02>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Andrew_J._G._Strandjord>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Christine_Jauernig>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Scott_Popelar>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2FS0026-2714%2801%2900236-0>
foaf:homepage <https://doi.org/10.1016/S0026-2714(01)00236-0>
dc:identifier DBLP journals/mr/StrandjordPJ02 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2FS0026-2714%2801%2900236-0 (xsd:string)
dcterms:issued 2002 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding). (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Andrew_J._G._Strandjord>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Christine_Jauernig>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Scott_Popelar>
swrc:number 2 (xsd:string)
swrc:pages 265-283 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/StrandjordPJ02/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/StrandjordPJ02>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr42.html#StrandjordPJ02>
rdfs:seeAlso <https://doi.org/10.1016/S0026-2714(01)00236-0>
dc:title Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding). (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 42 (xsd:string)