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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/SuTTT10>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Long_Bin_Tan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/T._Y._Tee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Vincent_B._C._Tan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Y._A._Su>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2010.01.043>
foaf:homepage <https://doi.org/10.1016/j.microrel.2010.01.043>
dc:identifier DBLP journals/mr/SuTTT10 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2010.01.043 (xsd:string)
dcterms:issued 2010 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Long_Bin_Tan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/T._Y._Tee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Vincent_B._C._Tan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Y._A._Su>
swrc:number 4 (xsd:string)
swrc:pages 564-576 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/SuTTT10/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/SuTTT10>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr50.html#SuTTT10>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2010.01.043>
dc:title Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 50 (xsd:string)