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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/SukSCKLP12>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chang-Kyu_Chung>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ho-Young_Son>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jin-Woo_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Joong_Do_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kyoung-Lim_Suk>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kyung-Wook_Paik>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2011.08.003>
foaf:homepage <https://doi.org/10.1016/j.microrel.2011.08.003>
dc:identifier DBLP journals/mr/SukSCKLP12 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2011.08.003 (xsd:string)
dcterms:issued 2012 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs). (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chang-Kyu_Chung>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ho-Young_Son>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jin-Woo_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Joong_Do_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kyoung-Lim_Suk>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kyung-Wook_Paik>
swrc:number 1 (xsd:string)
swrc:pages 225-234 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/SukSCKLP12/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/SukSCKLP12>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr52.html#SukSCKLP12>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2011.08.003>
dc:title Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs). (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 52 (xsd:string)