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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/SunGCLW18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chunqing_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hongtao_Chen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mingyu_Li>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Qiang_Guo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Siyu_Sun>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2017.12.012>
foaf:homepage <https://doi.org/10.1016/j.microrel.2017.12.012>
dc:identifier DBLP journals/mr/SunGCLW18 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2017.12.012 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Solderless bonding with nanoporous copper as interlayer for high-temperature applications. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chunqing_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hongtao_Chen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mingyu_Li>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Qiang_Guo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Siyu_Sun>
swrc:pages 198-204 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/SunGCLW18/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/SunGCLW18>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr80.html#SunGCLW18>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2017.12.012>
dc:title Solderless bonding with nanoporous copper as interlayer for high-temperature applications. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 80 (xsd:string)