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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/TanLCL05>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Cher_Ming_Tan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Guat_Cheng_Lim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kim_Peng_Lim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tai_Chong_Chai>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2005.07.049>
foaf:homepage <https://doi.org/10.1016/j.microrel.2005.07.049>
dc:identifier DBLP journals/mr/TanLCL05 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2005.07.049 (xsd:string)
dcterms:issued 2005 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Cher_Ming_Tan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Guat_Cheng_Lim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kim_Peng_Lim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tai_Chong_Chai>
swrc:number 9-11 (xsd:string)
swrc:pages 1572-1575 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/TanLCL05/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/TanLCL05>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr45.html#TanLCL05>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2005.07.049>
dc:title Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 45 (xsd:string)