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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/TegehallW15>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/G%E2%88%9A%E2%88%82ran_Wetter>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Per-Erik_Tegehall>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2015.07.014>
foaf:homepage <https://doi.org/10.1016/j.microrel.2015.07.014>
dc:identifier DBLP journals/mr/TegehallW15 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2015.07.014 (xsd:string)
dcterms:issued 2015 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Impact of laminate cracks under solder pads on the fatigue lives of ball grid array solder joints. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/G%E2%88%9A%E2%88%82ran_Wetter>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Per-Erik_Tegehall>
swrc:number 11 (xsd:string)
swrc:pages 2354-2370 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/TegehallW15/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/TegehallW15>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr55.html#TegehallW15>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2015.07.014>
dc:title Impact of laminate cracks under solder pads on the fatigue lives of ball grid array solder joints. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 55 (xsd:string)