Test structure assembly for bump bond yield measurement on high density flip chip technologies.
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/mr/UllanLCBCGMMPP06
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Carles_Puigdengoles
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Enric_Cabruja
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/G._Blanchot
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Giulio_Pellegrini
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/J._Garc%E2%88%9A%E2%89%A0a
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/M._Maiorino
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Manuel_Lozano_0003
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Miguel_Ull%E2%88%9A%C2%B0n
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Mokhtar_Chmeissani
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Ricardo_Mart%E2%88%9A%E2%89%A0nez
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2005.10.001
>
foaf:
homepage
<
https://doi.org/10.1016/j.microrel.2005.10.001
>
dc:
identifier
DBLP journals/mr/UllanLCBCGMMPP06
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1016%2Fj.microrel.2005.10.001
(xsd:string)
dcterms:
issued
2006
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/mr
>
rdfs:
label
Test structure assembly for bump bond yield measurement on high density flip chip technologies.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Carles_Puigdengoles
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Enric_Cabruja
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/G._Blanchot
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Giulio_Pellegrini
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/J._Garc%E2%88%9A%E2%89%A0a
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/M._Maiorino
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Manuel_Lozano_0003
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Miguel_Ull%E2%88%9A%C2%B0n
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Mokhtar_Chmeissani
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Ricardo_Mart%E2%88%9A%E2%89%A0nez
>
swrc:
number
7
(xsd:string)
swrc:
pages
1095-1100
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/mr/UllanLCBCGMMPP06/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/mr/UllanLCBCGMMPP06
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/mr/mr46.html#UllanLCBCGMMPP06
>
rdfs:
seeAlso
<
https://doi.org/10.1016/j.microrel.2005.10.001
>
dc:
title
Test structure assembly for bump bond yield measurement on high density flip chip technologies.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
46
(xsd:string)