New assembling technique for BGA packages without thermal processes.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/mr/VidekovTAI01
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dcterms:
bibliographicCitation
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dcterms:
issued
2001
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journal
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rdfs:
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New assembling technique for BGA packages without thermal processes.
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swrc:
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4
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swrc:
pages
611-615
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title
New assembling technique for BGA packages without thermal processes.
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41
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