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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/WatanabeKYOHKMS18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Akiko_Matsui>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hiroshi_Shimizu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kazuki_Watanabe_0006>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kizuku_Obinata>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Naoyuki_Yajima>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shunichi_Kikuchi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yoshiharu_Kariya>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yoshiyuki_Hiroshima>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2017.12.045>
foaf:homepage <https://doi.org/10.1016/j.microrel.2017.12.045>
dc:identifier DBLP journals/mr/WatanabeKYOHKMS18 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2017.12.045 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Akiko_Matsui>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hiroshi_Shimizu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kazuki_Watanabe_0006>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kizuku_Obinata>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Naoyuki_Yajima>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shunichi_Kikuchi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yoshiharu_Kariya>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yoshiyuki_Hiroshima>
swrc:pages 20-27 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/WatanabeKYOHKMS18/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/WatanabeKYOHKMS18>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr82.html#WatanabeKYOHKMS18>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2017.12.045>
dc:title Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 82 (xsd:string)