The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/mr/WongPTLLNS08
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/mr/WongPTLLNS08
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/B._K._Lok
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/C._K._Wong
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/F._L._Ng
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/H._J._Lu
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/J._W._Tew
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/John_H._L._Pang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Y._F._Sun
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2007.05.002
>
foaf:
homepage
<
https://doi.org/10.1016/j.microrel.2007.05.002
>
dc:
identifier
DBLP journals/mr/WongPTLLNS08
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1016%2Fj.microrel.2007.05.002
(xsd:string)
dcterms:
issued
2008
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/mr
>
rdfs:
label
The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/B._K._Lok
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/C._K._Wong
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/F._L._Ng
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/H._J._Lu
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/J._W._Tew
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/John_H._L._Pang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Y._F._Sun
>
swrc:
number
4
(xsd:string)
swrc:
pages
611-621
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/mr/WongPTLLNS08/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/mr/WongPTLLNS08
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/mr/mr48.html#WongPTLLNS08
>
rdfs:
seeAlso
<
https://doi.org/10.1016/j.microrel.2007.05.002
>
dc:
title
The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
48
(xsd:string)