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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/WuACW04>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/B._Y._Wu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/M._O._Alam>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Y._P._Wu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yan_Cheong_Chan>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2FS0026-2714%2803%2900214-2>
foaf:homepage <https://doi.org/10.1016/S0026-2714(03)00214-2>
dc:identifier DBLP journals/mr/WuACW04 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2FS0026-2714%2803%2900214-2 (xsd:string)
dcterms:issued 2004 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/B._Y._Wu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/M._O._Alam>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Y._P._Wu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yan_Cheong_Chan>
swrc:number 2 (xsd:string)
swrc:pages 295-302 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/WuACW04/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/WuACW04>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr44.html#WuACW04>
rdfs:seeAlso <https://doi.org/10.1016/S0026-2714(03)00214-2>
dc:title Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 44 (xsd:string)