Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/mr/XuLSCWS11
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/mr/XuLSCWS11
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/C._Liu
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/H._Xu
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/J._Wei
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/M._Sivakumar
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Vadim_V._Silberschmidt
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Zhong_Chen_0004
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2010.03.016
>
foaf:
homepage
<
https://doi.org/10.1016/j.microrel.2010.03.016
>
dc:
identifier
DBLP journals/mr/XuLSCWS11
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1016%2Fj.microrel.2010.03.016
(xsd:string)
dcterms:
issued
2011
(xsd:gYear)
swrc:
journal
<
https://dblp.l3s.de/d2r/resource/journals/mr
>
rdfs:
label
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/C._Liu
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/H._Xu
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/J._Wei
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/M._Sivakumar
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Vadim_V._Silberschmidt
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Zhong_Chen_0004
>
swrc:
number
1
(xsd:string)
swrc:
pages
113-118
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/mr/XuLSCWS11/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/mr/XuLSCWS11
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/mr/mr51.html#XuLSCWS11
>
rdfs:
seeAlso
<
https://doi.org/10.1016/j.microrel.2010.03.016
>
dc:
title
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
51
(xsd:string)