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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/YangJLP06>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kyung-Wook_Paik>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Se_Young_Yang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Soon-Bok_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Young-Doo_Jeon>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2005.06.007>
foaf:homepage <https://doi.org/10.1016/j.microrel.2005.06.007>
dc:identifier DBLP journals/mr/YangJLP06 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2005.06.007 (xsd:string)
dcterms:issued 2006 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kyung-Wook_Paik>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Se_Young_Yang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Soon-Bok_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Young-Doo_Jeon>
swrc:number 2-4 (xsd:string)
swrc:pages 512-522 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/YangJLP06/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/YangJLP06>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr46.html#YangJLP06>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2005.06.007>
dc:title Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 46 (xsd:string)