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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/YinACBL03>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chris_Bailey_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chunyan_Yin>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hua_Lu_0003>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/M._O._Alam>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yan_Cheong_Chan>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2FS0026-2714%2802%2900348-7>
foaf:homepage <https://doi.org/10.1016/S0026-2714(02)00348-7>
dc:identifier DBLP journals/mr/YinACBL03 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2FS0026-2714%2802%2900348-7 (xsd:string)
dcterms:issued 2003 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chris_Bailey_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chunyan_Yin>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hua_Lu_0003>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/M._O._Alam>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yan_Cheong_Chan>
swrc:number 4 (xsd:string)
swrc:pages 625-633 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/YinACBL03/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/YinACBL03>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr43.html#YinACBL03>
rdfs:seeAlso <https://doi.org/10.1016/S0026-2714(02)00348-7>
dc:title The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 43 (xsd:string)