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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/YoonNLLJ08>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bo-In_Noh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hyo-Soo_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jeong-Won_Yoon>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Seung-Boo_Jung>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Young-Ho_Lee>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2008.07.065>
foaf:homepage <https://doi.org/10.1016/j.microrel.2008.07.065>
dc:identifier DBLP journals/mr/YoonNLLJ08 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2008.07.065 (xsd:string)
dcterms:issued 2008 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bo-In_Noh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hyo-Soo_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jeong-Won_Yoon>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Seung-Boo_Jung>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Young-Ho_Lee>
swrc:number 11-12 (xsd:string)
swrc:pages 1864-1874 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/YoonNLLJ08/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/YoonNLLJ08>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr48.html#YoonNLLJ08>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2008.07.065>
dc:title Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 48 (xsd:string)