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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/ZhangWLCMTPS04>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Charles_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/D._Pinjala>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ee-Hua_Wong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Poi-Siong_Teo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Srinivasamurthy_Sampath>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tai_Chong_Chai>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xiaowu_Zhang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yiyi_Ma>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1016%2Fj.microrel.2003.09.006>
foaf:homepage <https://doi.org/10.1016/j.microrel.2003.09.006>
dc:identifier DBLP journals/mr/ZhangWLCMTPS04 (xsd:string)
dc:identifier DOI doi.org%2F10.1016%2Fj.microrel.2003.09.006 (xsd:string)
dcterms:issued 2004 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Thermo-mechanical finite element analysis in a multichip build up substrate based package design. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Charles_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/D._Pinjala>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ee-Hua_Wong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Poi-Siong_Teo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Srinivasamurthy_Sampath>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tai_Chong_Chai>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xiaowu_Zhang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yiyi_Ma>
swrc:number 4 (xsd:string)
swrc:pages 611-619 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/ZhangWLCMTPS04/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/ZhangWLCMTPS04>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr44.html#ZhangWLCMTPS04>
rdfs:seeAlso <https://doi.org/10.1016/j.microrel.2003.09.006>
dc:title Thermo-mechanical finite element analysis in a multichip build up substrate based package design. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 44 (xsd:string)