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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mva/ZhouKR98>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ashraf_A._Kassim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/H._Zhou>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Surendra_Ranganath>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1007%2Fs001380050088>
foaf:homepage <https://doi.org/10.1007/s001380050088>
dc:identifier DBLP journals/mva/ZhouKR98 (xsd:string)
dc:identifier DOI doi.org%2F10.1007%2Fs001380050088 (xsd:string)
dcterms:issued 1998 (xsd:gYear)
swrc:journal <https://dblp.l3s.de/d2r/resource/journals/mva>
rdfs:label A fast algorithm for detecting die extrusion defects in IC packages. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ashraf_A._Kassim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/H._Zhou>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Surendra_Ranganath>
swrc:number 1 (xsd:string)
swrc:pages 37-41 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mva/ZhouKR98/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mva/ZhouKR98>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mva/mva11.html#ZhouKR98>
rdfs:seeAlso <https://doi.org/10.1007/s001380050088>
dc:subject IC package inspection; Die extrusion defects; Linear feature extraction; Feature enhancement (xsd:string)
dc:title A fast algorithm for detecting die extrusion defects in IC packages. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 11 (xsd:string)