A fast algorithm for detecting die extrusion defects in IC packages.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/journals/mva/ZhouKR98
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https://dblp.l3s.de/d2r/resource/authors/Surendra_Ranganath
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issued
1998
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A fast algorithm for detecting die extrusion defects in IC packages.
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37-41
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dc:
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IC package inspection; Die extrusion defects; Linear feature extraction; Feature enhancement
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A fast algorithm for detecting die extrusion defects in IC packages.
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